HD3SS460_15 Datasheet, PDF (24/31 Pages) Texas Instruments – HD3SS460 4 x 6 Channels USB Type-C Alternate Mode MUX

RHR0028A
A
SCALE 2.700
3.6
B
3.4
PACKAGE OUTLINE
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
PIN 1 INDEX AREA
0.5
5.6
0.3
5.4
0.8 MAX
0.05
0.00
2±0.1
24X 0.5
2X 1.5
11
10
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
C
SEATING PLANE
0.08
14
EXPOSED
THERMAL PAD
15
(0.2) TYP
2X
4.5
4±0.1
SEE TERMINAL
DETAIL
1
PIN 1 ID
(OPTIONAL)
28
25
28X
0.5
0.3
24
28X
0.3
0.2
0.1 C A B
0.05
NOTES:
4219075/A 11/2014
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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