English
Language : 

HD3SS460_15 Datasheet, PDF (21/31 Pages) Texas Instruments – HD3SS460 4 x 6 Channels USB Type-C Alternate Mode MUX
www.ti.com
HD3SS460
SLLSEM7A – JANUARY 2015 – REVISED MARCH 2015
Layout Guidelines (continued)
• Decoupling caps should be placed next to each power terminal on the HD3SS460. Care should be taken to
minimize the stub length of the trace connecting the capacitor to the power pin.
• Avoid sharing vias between multiple decoupling caps.
• Place vias as close as possible to the decoupling cap solder pad.
• Widen VCC/GND planes to reduce effect of static and dynamic IR drop.
• The VBUS traces/planes must be wide enough to carry maximum of 2 A current.
11.2 Layout Example
Figure 12, Figure 13, and Figure 14 illustrate some guidelines for layout. Actual layout should be optimized for
various factors such as board geometry, connector type, and application.
Figure 12. USB Type C Connector to HD3SS460 Signal Routing
Figure 13. Dual SMT Mid-Mount Type C Connector Layout Example Zoom-in
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: HD3SS460
Submit Documentation Feedback
21