THS1401-EP Datasheet, PDF (22/27 Pages) Texas Instruments – 14-BIT, 1/3/8 MSPS DSP COMPATIBLE ANALOG-TO-DIGITAL CONVERTERS WITH INTERNAL REFERENCE AND PGA

THS1401-EP THS1403-EP THS1408-EP
14-BIT, 1/3/8 MSPS DSP COMPATIBLE ANALOG-TO-DIGITAL CONVERTERS
WITH INTERNAL REFERENCE AND PGA
SGLS129A – JULY 2002 – REVISED NOVEMBER 2002
PHP (S-PQFP-G48)
MECHANICAL DATA
PowerPAD PLASTIC QUAD FLATPACK
0,50
36
0,27
0,17
25
0,08 M
37
24
Thermal Pad
(see Note D)
48
13
1
1,05
0,95
12
5,50 TYP
7,20
6,80 ^SQ
9,20
8,80 ^SQ
1,20 MAX
0,15
0,05
Seating Plane
0,08
0,13 NOM
Gage Plane
0,25
0°– 7°
0,75
0,45
4146927/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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