THS1060 Datasheet, PDF (20/21 Pages) Texas Instruments – 10-BIT 60 MSPS IF SAMPLING COMMUNICATIONS ANALOG-TO-DIGITAL CONVERTER

THS1060
10-BIT 60 MSPS IF SAMPLING COMMUNICATIONS
ANALOG-TO-DIGITAL CONVERTER
SLAS212 – MARCH 2000
PHP (S-PQFP-G48)
MECHANICAL DATA
PowerPAD™ PLASTIC QUAD FLATPACK
0,50
36
0,27
0,17
25
0,08 M
37
24
Thermal Pad
(see Note D)
48
13
1
1,05
0,95
12
5,50 TYP
7,20
6,80 ^SQ
9,20
8,80 ^SQ
1,20 MAX
0,15
0,05
Seating Plane
0,08
0,13 NOM
Gage Plane
0,25
0°– 7°
0,75
0,45
4146927/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
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