OPA4171-Q1 Datasheet, PDF (20/35 Pages) Texas Instruments – OPAx171-Q1 36-V, Single-Supply, General-Purpose Operational Amplifier

OPA171-Q1, OPA2171-Q1, OPA4171-Q1
SBOS556B – JUNE 2011 – REVISED DECEMBER 2014
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9 Power Supply Recommendations
The OPAx171-Q1 family of devices is specified for operation from 4.5 V to 36 V (±2.25 V to ±18 V); many
specifications apply from –40°C to 125°C. Parameters that can exhibit significant variance with regard to
operating voltage or temperature are presented in the Typical Characteristics section.
CAUTION
Supply voltages larger than 40 V can permanently damage the device; see the
Absolute Maximum Ratings table.
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies. For detailed information on bypass capacitor placement, see the Layout section.
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
• Noise can propagate into analog circuitry through the power pins of the circuit as a whole and op amp
itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power
sources local to the analog circuitry.
– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
• Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground
planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically
separate digital and analog grounds paying attention to the flow of the ground current. See Circuit Board
Layout Techniques, SLOA089, for detailed information.
• In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace
perpendicular as opposed to in parallel with the noisy trace.
• Place the external components as close to the device as possible. As shown in Figure 44, keeping RF
and RG close to the inverting input minimizes parasitic capacitance.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
• Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly
reduce leakage currents from nearby traces that are at different potentials.
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