TLV320ADC3001_15 Datasheet, PDF (2/86 Pages) Texas Instruments – TLV320ADC3001 Low-Power Stereo ADC With Embedded miniDSP for Wireless Handsets and Portable Audio

TLV320ADC3001
SLAS548D – OCTOBER 2008 – REVISED SEPTEMBER 2015
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 4
6 Device Comparison Table..................................... 4
7 Pin Configuration and Functions ......................... 5
8 Specifications......................................................... 6
8.1 Absolute Maximum Ratings ...................................... 6
8.2 ESD Ratings.............................................................. 6
8.3 Recommended Operating Conditions....................... 6
8.4 Thermal Information .................................................. 6
8.5 Electrical Characteristics........................................... 7
8.6 Dissipation Ratings .................................................. 8
8.7 I²S/LJF/RJF Timing in Master Mode......................... 8
8.8 DSP Timing in Master Mode ..................................... 8
8.9 I²S/LJF/RJF Timing in Slave Mode........................... 9
8.10 DSP Timing in Slave Mode ..................................... 9
8.11 Typical Characteristics .......................................... 12
9 Parameter Measurement Information ................ 12
10 Detailed Description ........................................... 13
10.1 Overview ............................................................... 13
10.2 Functional Block Diagram ..................................... 13
10.3 Feature Description............................................... 14
10.4 Device Functional Modes...................................... 40
10.5 Programming......................................................... 40
10.6 Register Maps ....................................................... 42
11 Application and Implementation........................ 74
11.1 Application Information.......................................... 74
11.2 Typical Application ............................................... 74
12 Power Supply Recommendations ..................... 78
13 Layout................................................................... 79
13.1 Layout Guidelines ................................................. 79
13.2 Layout Example .................................................... 79
14 Device and Documentation Support ................. 80
14.1 Community Resources.......................................... 80
14.2 Trademarks ........................................................... 80
14.3 Electrostatic Discharge Caution ............................ 80
14.4 Glossary ................................................................ 80
15 Mechanical, Packaging, and Orderable
Information ........................................................... 80
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (April 2011) to Revision D
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision B (March 2010) to Revision C
Page
• Changed pinout diagram to top view...................................................................................................................................... 5
• Inserted missing table reference .......................................................................................................................................... 75
Changes from Revision A (November, 2008) to Revision B
Page
• Added miniDSP to data-sheet title.......................................................................................................................................... 1
• Added miniDSP bullet to the Features list.............................................................................................................................. 1
• Added a sentence about the miniDSP to the Description section.......................................................................................... 1
• Deleted YZH and WCSP options from the SIMPLIFIED BLOCK DIAGRAM. ........................................................................ 4
• Alphabetized Pin Functions table ........................................................................................................................................... 5
• Changed "complacence" to "compliance" in Note 2 of the Abs Max table............................................................................. 6
• Changed θ_JA to R_θJA ............................................................................................................................................................... 6
• Added AVDD = 3.3 V to Electrical Characteristics condition statement................................................................................. 7
• Added input common-mode voltage row to Electrical Characteristics table .......................................................................... 7
• Added integrated noise row to Electrical Characteristics ....................................................................................................... 8
• Added AVDD = 3.3 V to Electrical Characteristics condition statement................................................................................. 8
• Added metric dimensions to Note 1 of the DISSIPATIONS RATINGS table ......................................................................... 8
• Added rise and fall times to the waveform, Figure 1 ............................................................................................................ 10
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