TLE206X_07 Datasheet, PDF (2/78 Pages) Texas Instruments – EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE uPOWER OPERATIONAL AMPLIFIERS

TLE206x, TLE206xA, TLE206xB
ą
EXCALIBUR JFETĆINPUT HIGHĆOUTPUTĆDRIVE
µPOWER OPERATIONAL AMPLIFIERS
SLOS193B − FEBRUARY 1997 − REVISED MAY 2004
TLE2061 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP‡
(PW)
CERAMIC
FLAT PACK
(U)
500 µV
—
—
—
—
—
—
0°C to 70°C
1.5 mV TLE2061ACD
—
3 mV TLE2061CD
—
—
TLE2061ACP
—
—
—
TLE2061CP TLE2061CPWLE
—
500 µV
—
—
—
—
—
—
−40°C to 85°C 1.5 mV TLE2061AID
—
—
TLE2061AIP
—
—
3 mV TLE2061ID
—
—
TLE2061IP
—
—
500 µV
—
—
TLE2061BMJG
—
—
—
−55°C to 125°C 1.5 mV TLE2061AMD TLE2061AMFK TLE2061AMJG
—
—
TLE2061AMU
3 mV TLE2061MD TLE2061MFK TLE2061MJG
—
—
TLE2061MU
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2061ACDR).Chips are tested at 25°C.}
‡ _{The PW package is available left-end taped and reeled (indicated by the LE suffix on the device type (e.g., TLE2061CPWLE).}
TLE2062 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax SMALL OUTLINE† CHIP CARRIER
AT 25°C
(D)
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
0°C
1 mV
TLE2062BCD
—
to
2 mV
TLE2062ACD
—
70°C
4 mV
TLE2062CD
—
—
TLE2062BCP
—
TLE2062ACP
—
TLE2062CP
−40°C 1 mV
TLE2062BID
—
to
2 mV
TLE2062AID
—
85°C
4 mV
TLE2062ID
—
—
TLE2062BIP
—
TLE2062AIP
—
TLE2062IP
−55°C 1 mV
TLE2062BMD
—
TLE2062BMJG
—
to
2 mV
TLE2062AMD
TLE2062AMFK TLE2062AMJG
—
125°C 4 mV
TLE2062MD
TLE2062MFK TLE2062MJG
—
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2062ACDR).}
CERAMIC
FLAT PACK
(U)
—
—
—
—
—
—
—
TLE2062AMU
TLE2062MU
TLE2064 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax _{SMALL OUTLINEâ€}  CHIP CARRIER
AT 25°C
(D)
(FK)
CERAMIC DIP
(J)
PLASTIC DIP
(N)
0°C
2 mV
—
to
4 mV
TLE2064ACD
—
70°C
6 mV
TLE2064CD
TLE2064BCN
—
TLE2064ACN
TLE2064CN
−40°C 2 mV
—
to
4 mV
TLE2064AID
—
85°C
6 mV
TLE2064ID
TLE2064BIN
—
TLE2064AIN
TLE2064IN
−55°C 2 mV
—
TLE2064BMFK TLE2064BMJ
to
4 mV
TLE2064AMD
TLE2064AMFK TLE2064AMJ
—
125°C 6 mV
TLE2064MD
TLE2064MFK
TLE2064MJ
† _{The D packages are available taped and reeled. Add R suffix to device type, (e.g., TLE2064ACDR).}
CERAMIC
FLAT PACK
(W)
—
—
—
TLE2064AMW
TLE2064MW
2
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