TLC59401 Datasheet, PDF (2/29 Pages) Texas Instruments – 16-CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL

TLC59401
SBVS137 – DECEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
T_A
–40°C to +85°C
–40°C to +85°C
ORDERING INFORMATION⁽¹⁾
PACKAGE
28-pin HTSSOP PowerPAD™
32-pin 5 mm x 5 mm QFN
PART NUMBER
TLC59401PWP
TLC59401RHB
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
V_I
Input voltage range⁽²⁾
I_O
Output current (dc)
V_I
Input voltage range
V_O
Output voltage range
ESD rating
V_CC
V_(BLANK), V_(SCLK), V_(XLAT), V_(MODE), V_(SIN), V_(GSCLK), V_(IREF),
V_(TEST)
V_(SOUT), V_(XERR)
V_(OUT0) to V_(OUT15)
HBM (JEDEC JESD22-A114, human body model)
CDM (JEDEC JESD22-C101, charged device model)
T_J(max) Operating junction temperature
T_STG Storage temperature range
T_A
Operating ambient temperature range
Package thermal impedance⁽³⁾
HTSSOP (PWP)⁽⁴⁾
QFN (RHB)⁽⁴⁾
TLC59401
–0.3 to 6
130
–0.3 to V_CC +0.3
–0.3 to V_CC +0.3
–0.3 to 18
2
500
+150
–55 to +150
–40 to +85
31.58
35.9
UNIT
V
mA
V
V
V
kV
V
°C
°C
°C
°C/W
°C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) With PowerPAD soldered on PCB with 2-oz. trace of copper. See TI application report SLMA002 for further information.
2
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