TLC227X_07 Datasheet, PDF (2/67 Pages) Texas Instruments – Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

TLC227x, TLC227xA
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Advanced LinCMOS RAILĆTOĆRAIL
OPERATIONAL AMPLIFIERS
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
TLC2272 AVAILABLE OPTIONS
TA
0°C to 70°C
VIOmax
At 25°C
SMALL
OUTLINE†
(D)
950 µV TLC2272ACD
2.5 mV TLC2272CD
CERAMIC
LCC
(FK)
—
—
PACKAGED DEVICES
CERAMIC
DIP
(JG)
—
—
PLASTIC DIP
(P)
TSSOP‡
(PW)
TLC2272ACP ^TLC2272ACPW
TLC2272CP _TLC2272CPW
CERAMIC
FLAT PACK
(U)
—
—
950 µV TLC2272AID
—
2.5 mV TLC2272ID
—
−40°C to 125°C
950 µV TLC2272AQD
—
2.5 mV TLC2272QD
—
—
TLC2272AIP
—
—
—
TLC2272IP _TLC2272IPW
—
—
TLC2272AQPW
—
—
—
TLC2272QPW
—
−55°C to 125°C
950 µV
2.5 mV
TLC2272AMD TLC2272AMFK TLC2272AMJG TLC2272AMP
TLC2272MD TLC2272MFK TLC2272MJG TLC2272MP
—
† _{The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).}
‡ _{The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).}
§ _{Chips are tested at 25°C.}
TLC2272AMU
TLC2272MU
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP‡
(PW)
CERAMIC
FLAT PACK
(W)
0°C to 70°C
950 µV TLC2274ACD
2.5 mV TLC2274CD
—
TLC2274ACN TLC2274ACPW
—
TLC2274CN TLC2274CPW
—
950 µV TLC2274AID
2.5 mV TLC2274ID
—
−40°C to 125°C
950 µV TLC2274AQD
2.5 mV TLC2274QD
—
TLC2274AIN TLC2274AIPW
—
TLC2274IN TLC2274IPW
—
—
—
—
—
−55°C to 125°C
950 µV
2.5 mV
TLC2274AMD TLC2274AMFK TLC2274AMJ
TLC2274MD TLC2274MFK TLC2274MJ
TLC2274AMN
TLC2274MN
—
TLC2274AMW
TLC2274MW
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).}
‡ _{The PW package is available taped and reeled.}
§ _{Chips are tested at 25°C.}
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