TLC225X_08 Datasheet, PDF (2/74 Pages) Texas Instruments – Advanced LinCMOS RAIL-TO-RAIL VERY LOW-POWER OPERATIONAL AMPLIFIERS

TLC225x, TLC225xA
Advanced LinCMOS RAIL-TO-RAIL
VERY LOW-POWER OPERATIONAL AMPLIFIERS
SLOS176D – FEBRUARY 1997 – REVISED MARCH 2001
TLC2252 AVAILABLE OPTIONS
TA
0°C to 70°C
VIOmax
AT 25°C
1500 µV
SMALL
OUTLINE^†
(D)
TLC2252CD
CHIP
CARRIER
(FK)
—
PACKAGED DEVICES
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
—
TLC2252CP
– 40°C to 125°C
850 µV TLC2252AID
1500 µV TLC2252ID
—
—
—
TLC2252AIP
—
TLC2252IP
– 40°C to 125°C
850 µV TLC2252AQD
1500 µV TLC2252QD
—
—
—
—
—
—
– 55°C to 125°C
850 µV
1500 µV
—
—
TLC2252AMFK TLC2252AMJG
—
TLC2252MFK TLC2252MJG
—
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR).}
‡ _{The PW package is available only left-ended taped and reeled.}
§ _{Chip forms are tested at 25°C only.}
TSSOP^‡
(PW)
TLC2252CPW
TLC2252AIPW
—
—
—
—
—
CERAMIC
FLATPACK
(U)
—
—
—
—
—
TLC2252AMU
TLC2252MU
TLC2254 AVAILABLE OPTIONS
TA
VIOmax
AT 25°C
SMALL
OUTLINE^†
(D)
CHIP
CARRIER
(FK)
PACKAGED DEVICES
CERAMIC
DIP
(J)
PLASTIC DIP
(N)
TSSOP^‡
(PW)
0°C to
70°C
1500 µV TLC2254CD
—
—
TLC2254CN
TLC2254CPW
– 40°C to
850 µV TLC2254AID
—
125°C
1500 µV TLC2254ID
—
—
TLC2254AIN
TLC2254AIPW
—
TLC2254IN
—
– 40°C to
850 µV TLC2254AQD
—
—
—
—
125°C
1500 µV TLC2254QD
—
—
—
—
– 55°C to
850 µV
—
TLC2254AMFK TLC2254AMJ
—
—
125°C
1500 µV
—
TLC2254MFK
TLC2254MJ
—
—
† _{The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2254CDR).}
‡ _{The PW package is available only left-end taped and reeled. Chips are tested at 25°C.}
§ _{Chip forms are tested at 25°C only.}
CERAMIC
FLATPACK
(W)
—
—
—
—
—
TLC2254AMW
TLC2254MW
2
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