THS7320 Datasheet, PDF (2/35 Pages) Texas Instruments – 3-Channel ED Filter Video Amplifier with 4-V/V Gain

THS7320
SBOS565B – JULY 2011 – REVISED SEPTEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGED DEVICES
THS7320IYHCR
THS7320IYHCT
PACKAGE/ORDERING INFORMATION⁽¹⁾
PACKAGE TYPE
PACKAGE MARKING
TRANSPORT MEDIA,
QUANTITY
DSBGA (9-Ball WCSP)
QJK
Tape and Reel, 3000
DSBGA (9-Ball WCSP)
QJK
Tape and Reel, 250
ECO STATUS⁽²⁾
Pb-Free, Green
Pb-Free, Green
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) Eco-Status information. Additional details including specific material content can be accessed at www.ti.com/leadfree.
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion
dates, go to www.ti.com/leadfree.
Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that does not exceed 0.1% of total
product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Supply voltage, V_S+ to GND
Video input voltage, video enable pin
Output current, I_O
Continuous power dissipation
Maximum junction temperature, any condition⁽²⁾, T_J
Maximum junction temperature, continuous operation, long-term reliability⁽³⁾, T_J
Storage temperature range, T_stg
Human body model (HBM)
ESD ratings: all pins
Charge device model (CDM)
Machine model (MM)
ESD ratings: video output pins IEC 61000-4-2 contact discharge
VALUE
UNIT
–0.4 to +5.5
V
–0.4 to V_S+ + 0.4
V
±75
mA
See Thermal Information table
+150
°C
+125
°C
+300
°C
6000
V
1000
V
200
V
20
kV
(1) Stresses these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those
specified is not implied.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
RECOMMENDED OPERATING CONDITIONS
Supply voltage, V_S+
Ambient temperature, T_A
MIN
NOM
MAX UNIT
2.6
3
5
V
–40
+85
°C
2
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