THS6132 Datasheet, PDF (2/21 Pages) Texas Instruments – HIGH EFFICIENCY CLASS - G ADSL LINE DRIVER

THS6132
SLLS543A – SEPTEMBER 2002 – REVISED FEBRUARY 2003
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage.
ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
CODE
THS6132VFP TQFP-32 PowerPAD
THS6132RGW
Leadless 25-pin 5,mm x
5, mm PowerPAD
VFP–32
RGW–25
SYMBOL
THS6132
6132
TA
–40°C to 85°C
ORDER NUMBER
THS6132VFP
THS6132VFPR
THS6132RGWR
TRANSPORT
MEDIA
Tube
Tape and reel
Tape and reel
PACKAGE DISSIPATION RATINGS
PACKAGE
Θ_JA
Θ_JC
TA ≤ 25°C
TA = 70°C
TA = 85°C
POWER RATING(1) POWER RATING(1) POWER RATING(1)
VFP–32
29.4°C/W
0.96°C/W
3.57 W
2.04 W
1.53 W
RGW–25
31°C/W
1.7°C/W
3.39 W
1.94 W
1.45 W
(1) _{Power rating is determined with a junction temperature of 130°C. This is the point where distortion starts to substantially increase. Thermal}
management of the final PCB should strive to keep the junction temperature at or below 125_C for best performance.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
Supply voltage, VCC(H) and VCC(L) ⁽²⁾
Input voltage, VI
Output current, IO ⁽³⁾
Differential input voltage, VIO
Maximum junction temperature, TJ (see Dissipation Rating Table for more information)
Operating free–air temperature, TA
Storage temperature, TStg
Lead temperature, 1,6 mm (1/16–inch) from case for 10 seconds
THS6132
±16.5 V
±VCC(L)
900 mA
±2 V
150°C
–40°C to 85°C
65°C to 150°C
300°C
HBM
1 kV
ESD ratings CDM
500 V
MM
200 V
(1) _{Stressesbeyondthoselistedunder“absolutemaximumratings”maycausepermanentdamagetothedevice.Thesearestressratingsonly,and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) _{VCC(H) must always be greater than or equal to VCC(L)forproperoperation.Class-ABmodeoperationoccurswhenVCC(H) is equal toVCC(L)}
and is considered acceptable operation for the THS6132 even though it is not fully specified in this mode of operation.
(3) _{TheTHS6132 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating}
plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that could permanently damage
the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package.
PowerPAD is a trademark of Texas Instruments.
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