THS6132 Datasheet, PDF (16/21 Pages) Texas Instruments – HIGH EFFICIENCY CLASS - G ADSL LINE DRIVER

THS6132
SLLS543A – SEPTEMBER 2002 – REVISED FEBRUARY 2003
RGW (S-PQFP-N20)
MECHANICAL DATA
5,15
4,85
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PLASTIC QUAD FLATPACK
Pin 1 Index Area
Top and Bottom
1,00
0,80
0,08
0,75
20X _0,35
20
5,15
4,85
3,25 SQ MAX
1
0,05
0,00
0,65
5
6
0,20 REF.
Seating Plane
16
15
2,60
10
Exposed Thermal Die Pad
(See Note D)
11
0,38
20X _0,23
0,10
4204100/A 01/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Quad Flatpack, No-leads, (QFN) package configuration.
D. The package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane.
E. Falls within JEDEC M0-220.
16