THS6052IDDA Datasheet, PDF (2/21 Pages) Texas Instruments – 175 mA, ±12 V ADSL CPE LINE DRIVERS

THS6052, THS6053
175 mA, ±12 V ADSL CPE LINE DRIVERS
SLOS293D − JUNE 2000 − REVISED DECEMBER 2001
TA
0°C to 70°C
−40°C to 85°C
SOIC-8
(D)
THS6052CD
THS6052ID
AVAILABLE OPTION
PACKAGED DEVICE
SOIC-8 PowerPAD
(DDA)
SOIC-14
(D)
THS6052CDDA
THS6053CD
THS6052IDDA
THS6053ID
TSSOP-14
(PWP)
THS6053CPWP
THS6053IPWP
EVALUATION
MODULES
THS6052EVM
THS6053EVM
—
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC+ to V_CC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V_CC
Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 mA
Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V
Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table
Operating free-air temperature, T_A: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T_stg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6052 and THS6053 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the
PowerPAD thermally enhanced package.
DISSIPATION RATING TABLE
PACKAGE
θ_JA
TA = 25°C
θ_JC
TJ = 150°C
POWER RATING
D-8
95°C/W‡
38.3°C/W‡
1.32 W
DDA
45.8°C/W‡
9.2°C/W‡
2.73 W
D-14
66.6°C/W‡
26.9°C/W‡
1.88 W
PWP
37.5°C/W
1.4°C/W
3.3 W
‡ _{This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test}
PCB, the Θ_JA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package.
recommended operating conditions
Supply voltage, VCC+ to VCC−
Operating free-air temperature, TA
Dual supply
Single supply
C-suffix
I-suffix
MIN NOM
±5
10
0
−40
MAX
±15
30
70
85
UNIT
V
°C
2
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265