THS4500 Datasheet, PDF (2/37 Pages) Texas Instruments – WIDEBAND, LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIERS

THS4500
THS4501
SLOS350D − APRIL 2002 − REVISED JANUARY 2004
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Supply voltage, V_S
Input voltage, V_I
Output current, I_O ⁽²⁾
Differential input voltage, V_ID
Continuous power dissipation
16.5 V
±V_S
150 mA
4V
See Dissipation Rating Table
Maximum junction temperature, T_J ⁽³⁾
Maximum junction temperature, continuous
operation, long term reliability T_J ⁽⁴⁾
Operating free-air temperature
range, T_A
C suffix
I suffix
150°C
125°C
0°C to 70°C
−40°C to 85°C
Storage temperature range, T_stg
Lead temperature
1,6 mm (1/16 inch) from case for 10 seconds
−65°C to 150°C
300°C
HBM
4000 V
ESD ratings:
CDM
2000 V
MM
100 V
(1) _{Stresses above these ratings may cause permanent damage.}
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2) _{The THS4500/1 may incorporate a PowerPAD on the underside}
of the chip. This acts as a heat sink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure
to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI
technical briefs SLMA002 and SLMA004 for more information
about utilizing the PowerPAD thermally enhanced package.
(3) _{The absolute maximum temperature under any condition is}
limited by the constraints of the silicon process.
(4) _{The maximum junction temperature for continuous operation is}
limited by package constraints. Operation above this temperature
may result in reduced reliability and/or lifetime of the device.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE DISSIPATION RATINGS
PACKAGE
θ_JC
θ_JA⁽¹⁾
POWER RATING(2)
(°C/W) (°C/W) _{TA ≤ 25°C TA = 85°C}
D (8 pin)
38.3 97.5
1.02 W
410 mW
DGN (8 pin)
4.7
58.4
1.71 W 685 mW
DGK (8 pin)
54.2
260
385 mW 154 mW
(1) _{This data was taken using the JEDEC standard High-K test PCB.}
(2) _{Power rating is determined with a junction temperature of 125°C.}
This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the
junction temperature at or below 125°C for best performance and
long term reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Dual supply
Supply voltage
Single supply 4.5
±5 ±7.5
V
5
15
Operating free-
C suffix
0
air temperature,
T_A
I suffix
−40
70
°C
85
PACKAGE/ORDERING INFORMATION
TEMPERATURE
PLASTIC
SMALL OUTLINE
(D)
ORDERABLE PACKAGE AND NUMBER
PLASTIC MSOP(1)
PowerPad
PLASTIC MSOP(1)
(DGN)
SYMBOL
(DGK)
SYMBOL
0°C to 70°C
THS4500CD
THS4501CD
THS4500CDGN
THS4501CDGN
BFB
BFD
THS4500CDGK
THS4501CDGK
ATV
ATW
−40°C to 85°C
THS4500ID
THS4501ID
THS4500IDGN
THS4501IDGN
BFC
BFE
THS4500IDGK
THS4501IDGK
ASV
ASW
(1) _{All packages are available taped and reeled. The R suffix standard quantity is 2500. The T suffix standard quantity is 250 (e.g., THS4501DT).}
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