THS4302 Datasheet, PDF (2/23 Pages) Texas Instruments – WIDEBAND FIXED-GAIN AMPLIFIER

THS4302
SLOS403G – OCTOBER 2002 – REVISED JANUARY 2005
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATING
over operating free-air temperature range unless otherwise noted ⁽¹⁾
Supply voltage, V_S
Input voltage, V_I
Output current, I_O
Continuous power dissipation
Maximum junction temperature, T_J
Maximum junction temperature, continuous operation, long term reliability, T_J(2)
Storage temperature range, T_stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
UNIT
6V
±V_S
200 mA
See Dissipation Rating Table
150°C
125°C
-65°C to 150°C
300°C
(1) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. Stresses above these
ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not
implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
RECOMMENDED OPERATING CONDITIONS
Supply voltage, V_CC (V_S+ and V_S-)
Common-mode input voltage range
Dual supply
Single supply
MIN
±1.5
3
V_S- +1
MAX
±2.5
5
V_S+ -1
UNIT
V
V
PACKAGE DISSIPATION RATINGS
PACKAGE
RGT (16)⁽³⁾
Θ_JC(°C/W)
2.4
Θ_JA(°C/W) ⁽¹⁾
39.5
POWER RATING⁽²⁾
T_A ≤ 25°C
3.16
T_A = 25°C
1.65 W
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long
term reliability.
(3) The THS4302 device may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which can permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the
PowerPAD thermally enhanced package.
AVAILABLE OPTIONS
INTERNAL FIXED GAIN
RESISTOR VALUES (+5)
R_G
50 Ω
R_F
200 Ω
PACKAGED DEVICES
THS4302RGTT
THS4302RGTR
PACKAGE TYPE⁽¹⁾
Leadless (RGT-16)
(1) The PowerPAD is electrically isolated from all other pins.
TRANSPORTATION MEDIA,
QUANTITY
Tape and Reel, 250
Tape and Reel, 3000
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