PT6360 Datasheet, PDF (2/14 Pages) Texas Instruments – 11 A 12-V Input Adjustable Integrated Switching Regulator

PT6360 Series
11 A 12-V Input Adjustable
Integrated Switching Regulator
SLTS179A - JANUARY 2003 - REVISED APRIL 2003
Performance Specifications (Unless otherwise stated, Ta =25 °C, Vin =12 V, Cin =560 µF, Cout =0 µF, and Io =Iomax)
Characteristics
Symbols
Conditions
PT6360 SERIES
Min
Typ
Max
Units
Output Current
Input Voltage Range
Set-Point Voltage Tolerance
Temperature Variation
Line Regulation
Load Regulation
Total Output Variation
Efficiency
Vo Ripple (pk-pk)
Transient Response
Over-Current Threshold
Output Voltage Adjust
Switching Frequency
Inhibit Control (pin1)
Input High Voltage
Input Low Voltage
Input Low Current
Standby Input Current
External Input Capacitance
External Output Capacitance
Operating Temperature Range
Solder Reflow Temperature
Storage Temperature
Reliability
Mechanical Shock
Mechanical Vibration
Weight
Flammability
Io
Vin
Vo tol
∆Regtemp
∆Regline
∆Regload
∆Regtot
η
Vr
t_tr
∆Vtr
ITRIP
Vo adj
ƒs
VIH
VIL
IIL
Iin standby
C_in
Cout
T_a
Treflow
T_s
MTBF
—
—
Vin =12 V
Over Io range
Vo < 3.3 V
Vo ≥ 3.3 V
–40 °C <Ta < +85 °C
Over Vin range
Over Io range
Includes set-point, line, load,
–40 °C ≤ Ta ≤ +85 °C
Io =8 A
PT6361 ( 5 V)
PT6362 (3.3 V)
PT6363 (2.5 V)
PT6364 (1.8 V)
PT6365 (1.5 V)
PT6366 (1.2 V)
PT6367 (1.0 V)
20 MHz bandwidth
Vo = 5.0 V
V_o = 3.3 V
Vo ≤ 2.5 V
1 A/µs load step, 50 to 100 % Iomax,
Cout =330 µF
Recovery Time
Vo over/undershoot
Reset, followed by auto-recovery
With Vo Adjust
Over Vin and Io ranges
Referenced to GND (pins 5–8)
Pin 1 to GND
Pin 1 to GND
Over V_in range
Surface temperature of pins or case
—
Per Bellcore TR-332
50% stress, Ta =40°C, ground benign
Mil-STD-883D, Method 2002.3
Half Sine, mounted to a fixture
Mil-STD-883D, Method 2007.2,
20-2000 Hz, PCB mounted
—
Materials meet UL 94V-0
0
0
10.8
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
300
2
–0.2
—
—
560 (3)
0
–40
—
–40
8.0
—
—
—
—
—
—
—
±0.5
±3
±5
—
93
91
90
87
85
82
80
50
25
15
50
70
16
±15 ⁽¹⁾
350
—
—
–10
5
—
330 (4)
—
—
—
—
500
20 (7)
10
11
10
A
13.2
V
±2
%Vo
—
%Vo
—
mV
—
mV
±3
%V_o
—
—
—
—
%
—
—
—
—
—
mV_pp
—
—
µSec
—
mV
—
A
—
%
400
kHz
Open (2)
0.3
—
—
—
5,000
85 (5)
215 (6)
125
—
V
µA
mA
µF
µF
°C
°C
°C
106 Hrs
—
G’s
—
G’s
—
grams
Notes: (1) This is a typical value. For the adjustment limits of a specific model consult the related application note on output voltage adjustment.
(2) The Inhibit control (pin 1) has an internal pull-up to Vin, and if left open-circuit the module will operate when input power is applied. A small low-
leakage (<100 nA) MOSFET is recommended to control this input. See application notes for more information.
(3) A 560 µF electrolytic input capacitor is required for proper operation. The capacitor must be rated for a minimumm of 1.3 Arms of ripple current.
(4) An external output capacitor is not required for basic operation. Adding 330µF of distributed capacitance at the load will improve the transient response,
and reduce output ripple voltage.
(5) See SOA curves or consult factory for the appropriate derating.
(6) During solder reflow of SMD package version do not elevate the module case, pins, or internal component temperatures above a peak of 215 °C. For
further guidance refer to the application note, “Reflow Soldering Requirements for Plug-in Power Surface Mount Products,” (SLTA051).
(7) The case pins on the through-hole package types (suffixes N & A) must be soldered. For more information see the applicable package outline drawing.
For technical support and more information, see inside back cover or visit www.ti.com