OPA330_1 Datasheet, PDF (2/30 Pages) Texas Instruments – 50mV VOS, 0.25mV/°C, 35mA CMOS OPERATIONAL AMPLIFIERS Zerø-Drift Series

OPA330
OPA2330
OPA4330
SBOS432D – AUGUST 2008 – REVISED JUNE 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
OPA330
OPA2330
OPA4330
OPA4330
PACKAGE INFORMATION⁽¹⁾
PACKAGE-LEAD
PACKAGE DESIGNATOR
SOT23-5
DBV
SC70-5
DCK
SOIC-8
D
WCSP-5
YFF
SOIC-8
D
DFN-8
DRB
MSOP-8
DGK
SOIC-14
D
TSSOP-14
QFN-14 ⁽²⁾
PW
RGY
PACKAGE MARKING
OCFQ
CHL
O330A
OEH
O2330A
OCGQ
OCGQ
O4330A
O4330A
4330A
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at ti.com.
(2) Product preview device.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Supply Voltage, V_S = (V+) – (V–)
Signal Input Terminals, Voltage⁽²⁾
Signal Input Terminals, Current⁽²⁾
Output Short-Circuit⁽³⁾
Operating Temperature
Storage Temperature
Junction Temperature
ESD
Ratings:
Human Body Model (HBM)
Charged Device Model (CDM)
Machine Model (MM)
OPA330, OPA2330, OPA4330
+7
(V–) –0.3 to (V+) + 0.3
±10
Continuous
–40 to +150
–65 to +150
+150
4000
1000
400
UNIT
V
V
mA
°C
°C
°C
V
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground, one amplifier per package.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
OPA330AIYFF
YFF
UNITS
5 PINS
q_JA
q_JCtop
q_JB
y_JT
y_JB
q_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
130
54
51
°C/W
1
50
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Product Folder Link(s): OPA330 OPA2330 OPA4330