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OPA2695 Datasheet, PDF (2/40 Pages) Texas Instruments – Dual, Ultra-Wideband, Current-Feedback OPERATIONAL AMPLIFIER with Disable
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OPA2695
SBOS354 – APRIL 2008..................................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
OPA2695
OPA2695
PACKAGE
SO-8
QFN-16
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
D
–40°C to +85°C
RGT
–40°C to +85°C
PACKAGE
MARKING
OP2695
2695
ORDERING
NUMBER
OPA2695ID
OPA2695IDR
OPA2695IRGTT
OPA2695IRGTR
TRANSPORT MEDIA,
QUANTITY
Rails, 75
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Power supply
Internal power dissipation
Differential input voltage
Input common-mode voltage range
Storage temperature range: D, RGT
Lead temperature (soldering, 10s)
Junction temperature (TJ)
Junction temperature (TJ), continuous operation
Human body model (HBM)(2)
ESD rating:
Charged device model (CDM)
Machine model (MM)
OPA2695
±6.5
See Thermal Analysis
±1.2
±VS
–40 to +125
+300
+150
+140
1500
1000
50
UNITS
VDC
V
V
°C
°C
°C
°C
V
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these and any other conditions beyond
those specified is not supported.
(2) Pins 1 and 4 on the SO-8 package and pins 6 and 15 on the QFN package are greater than 500V HBM.
SO-8 PACKAGE
(TOP VIEW)
PIN CONFIGURATIONS
QFN-16 PACKAGE
(TOP VIEW)
-In A 1
+In A 2
+In B 3
-In B 4
8 Out A
7 -VS
6 +VS
5 Out B
DIS A 1
+IN A 2
+IN B 3
DIS B 4
12 -VS
11 +VS
10 +VS
9 -VS
2
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