OPA2340TDF1 Datasheet, PDF (2/5 Pages) Texas Instruments – SINGLE-SUPPLY, RAIL-TO-RAIL OPERATIONAL AMPLIFIER MicroAmplifier

OPA2340-DIE
SBOS691A – JUNE 2013 – REVISED SEPTEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
10.5 mils.
BACKSIDE FINISH
Silicon with backgrind
BACKSIDE
POTENTIAL
Floating
BOND PAD
METALLIZATION COMPOSITION
AlSiCu
BOND PAD
THICKNESS
800 nm
2
Submit Documentation Feedback
Product Folder Links: OPA2340-DIE
Copyright © 2013, Texas Instruments Incorporated