OPA1662-Q1 Datasheet, PDF (2/30 Pages) Texas Instruments – Low-Power, Low Noise and Distortion, Bipolar-Input AUDIO OPERATIONAL AMPLIFIERS

OPA1662-Q1
SLOS805B – JULY 2012 – REVISED OCTOBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
T_A
–40°C to 85°C
–40°C to 85°C
ORDERING INFORMATION⁽¹⁾
ORDERABLE PART NUMBER
OPA1662AIDRQ1
OPA1662AIDGKRQ1
TOP-SIDE MARKING
O1662Q
OUUI
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range (unless otherwise noted).
Supply voltage, V_S = (V+) – (V–)
Input voltage
Input current (all pins except power-supply pins)
Output short-circuit⁽²⁾
Operating temperature range
Storage temperature range
Junction temperature
ESD ratings
Human body model (HBM) AEC-Q100 Classification Level H2
Charged device model (CDM) AEC-Q100 Classification Level C3B
OPA1662-Q1
40
(V–) – 0.5 to (V+) + 0.5
±10
Continuous
–40 to 125
–65 to 150
200
2
750
UNIT
V
V
mA
°C
°C
°C
kV
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Short-circuit to V_S/2 (ground in symmetrical dual supply setups), one amplifier per package.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
OPA1662-Q1
D (SO)
DGK (MSOP)
8 PINS
8 PINS
156.3
225.4
85.5
78.8
64.9
110.5
33.8
14.6
64.3
108.5
N/A
N/A
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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