OP07C Datasheet, PDF (2/7 Pages) STMicroelectronics – VERY LOW OFFSET SINGLE BIPOLAR OPERATIONAL AMPLIFIERS

OP07C, OP07D, OP07Y
PRECISION OPERATIONAL AMPLIFIERS
SLOS099B – OCTOBER 1983 – REVISED AUGUST 1996
OP07Y chip information
These chips, properly assembled, display characteristics similar to the OP07. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(8)
(7)
(1)
OFFSET N1
(6)
IN ^{+ (3)}
(2)
IN –
(8)
OFFSET N2
VCC+
(7)
+
(6)
OUT
–
(4)
VCC _–
72
(1)
(2)
(3)
(4)
94
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
2
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