LMX9830 Datasheet, PDF (2/48 Pages) National Semiconductor (TI) – BluetoothTM Serial Port Module

September 15, 2008
LMX9830
Bluetooth^® Serial Port Module
1.0 General Description
The National Semiconductor LMX9830 Bluetooth Serial Port
module is a highly integrated Bluetooth 2.0 baseband con-
troller and 2.4 GHz radio, combined to form a complete small
form factor (6.1 mm x 9.1 mm x 1.2 mm) Bluetooth node.
All hardware and firmware is included to provide a complete
solution from antenna through the complete lower and upper
layers of the Bluetooth stack, up to the application including
the Generic Access Profile (GAP), the Service Discovery Ap-
plication Profile (SDAP), and the Serial Port Profile (SPP).
The module includes a configurable service database to fulfil
service requests for additional profiles on the host. Moreover,
the LMX9830 is pre-qualified as a Bluetooth Integrated Com-
ponent. Conformance testing through the Bluetooth qualifi-
cation program enables a short time to market after system
integration by insuring a high probability of compliance and
interoperability.
Based on National's CompactRISC^® 16-bit processor archi-
tecture and Digital Smart Radio technology, the LMX9830 is
optimized to handle the data and link management process-
ing requirements of a Bluetooth node.
The firmware supplied in the on-chip ROM memory offers a
complete Bluetooth (v2.0) stack including profiles and com-
mand interface. This firmware features point-to-point and
point-to-multipoint link management supporting data rates up
to the theoretical maximum over RFComm of 704 kbps (Best
in Class in the industry). The internal memory supports up to
7 active Bluetooth data links and one active SCO link.
The on-chip Patch RAM provided for lowest cost and risk, al-
lows the flexibility of firmware upgrade.
The LMX9830 module is lead free and RoHS (Restriction of
Hazardous Substances) compliant. For more information on
those quality standards, please visit our green compliance
website at http://www.national.com/quality/green/
2.0 Features
■ ^{Compliant with the Bluetooth 2.0 Core Specification}
— Qualified Design ID (PRD 2.0): B012364
■ ^{Better than -80 dBm input sensitivity}
■ ^{Class 2 operation}
■ ^{Low power consumption}
■ ^{High integration:}
— Implemented in 0.18 μm CMOS technology
— RF includes antenna filter and switch on-chip
3.0 Other Features
3.1 DIGITAL HARDWARE
■ ^{Baseband and Link Management processors}
■ ^{CompactRISC Core}
■ ^{Embedded ROM and Patch RAM memory}
■ ^{UART Command/Data Port:}
— Support for up to 921.6k baud rate
■ ^{Auxiliary Host Interface Ports:}
— Link Status
— Transceiver Status (Tx or Rx)
— Three General Purpose I/Os, available through the API
— Alternative IO functions:
■ ^{Link Status}
■ ^{Transport layer activity}
■ ^{Advanced Power Management (APM) features:}
— Advanced power management functions
■ ^{Advanced Audio Interface for external PCM codec}
■ ^{ACCESS.bus and SPI/Microwire for interfacing with}
external non-volatile memory
3.2 FIRMWARE
■ ^{Complete Bluetooth Stack including:}
— Baseband and Link Manager
— L2CAP, RFCOMM, SDP
— Profiles:
■ ^GAP
■ ^SDAP
■ ^SPP
■ ^{Additional Profile support on Host, e.g.:}
— Dial Up Networking (DUN)
— Facsimile Profile (FAX)
— File Transfer Protocol (FTP)
— Object Push Profile (OPP)
— Synchronization Profile (SYNC)
— Headset (HSP)
— Handsfree Profile (HFP)
— Basic Imaging Profile (BIP)
— Basic Printing Profile (BPP)
■ ^{On-chip application including:}
— Default connections
— Command Interface:
■ ^{Link setup and configuration (also Multipoint)}
■ ^{Configuration of the module}
■ ^{Service database modifications}
— UART Transparent mode
— Optimized cable replacement :
■ ^{Automatic transparent mode}
Bluetooth^® is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor Corporation.
CompactRISC^® is a registered trademark of National Semiconductor Corporation.
© 2008 National Semiconductor Corporation 201800
www.national.com