DAC8832 Datasheet, PDF (2/26 Pages) Texas Instruments – 16-Bit, Ultra-Low Power, Voltage-Output Digital-to-Analog Converter

DAC8832
SBAS380A – FEBRUARY 2006 – REVISED APRIL 2006
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION⁽¹⁾
PRODUCT
MINIMUM
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
DAC8832IRGY
±4
±1
DAC8832IBRGY
±2
±1
DAC8832ICRGY
±1
±1
POWER-
ON
RESET
VALUE
Mid-Code
Mid-Code
Mid-Code
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
PACKAGE PACKAGE-
MARKING
LEAD
8832I
QFN-14
8832I
QFN-14
8832I
QFN-14
PACKAGE
DESIGNATOR
RGY
RGY
RGY
ORDERING
NUMBER
DAC8832IRGYT
DAC8832IRGYR
DAC8832IBRGYT
DAC8832IBRGYR
DAC8832ICRGYT
DAC8832ICRGYR
TRANSPORT
MEDIA,
QUANTITY
Tape and Reel, 250
Tape and Reel, 1000
Tape and Reel, 250
Tape and Reel, 1000
Tape and Reel, 250
Tape and Reel, 1000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_DD to AGND
Digital input voltage to DGND
V_OUT to AGND
AGND, AGNDF, AGNDS to DGND
Operating temperature range
Storage temperature range
Junction temperature range (T_J max)
Power dissipation
Thermal impedance, θ_JA
DAC8832
–0.3 to +7
–0.3 to +V_DD + 0.3
–0.3 to +V_DD + 0.3
–0.3 to +0.3
–40 to +85
–65 to +150
+150
(T_J max – T_A) / θ_JA
54.9
UNIT
V
V
V
V
°C
°C
°C
W
°C/W
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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