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CD74FCT244M96 Datasheet, PDF (2/11 Pages) Texas Instruments – BiCMOS OCTAL BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS
CD74FCT244, CD74FCT244AT
BiCMOS OCTAL BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCBS722B – JULY 2000 – REVISED AUGUST 2003
logic diagram (positive logic)
1OE 1
2
1A1
18 1Y1
2OE 19
11
2A1
9 2Y1
1A2 4
16 1Y2
2A2 13
7 2Y2
1A3 6
14 1Y3
2A3 15
5 2Y3
1A4 8
12 1Y4
2A4 17
3 2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
DC supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
DC input clamp current, IIK (VI < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
DC output clamp current, IOK (VO < –0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
DC output sink current per output pin, IOL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
DC output source current per output pin, IOH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA
Continuous current through VCC, ICC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 mA
Continuous current through GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 mA
Package thermal impedance, θJA (see Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
SM package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
MIN MAX UNIT
VCC
VIH
VIL
VI
VO
IOH
IOL
∆t/∆v
Supply voltage
High-level input voltage
Low-level input voltage
Input voltage
Output voltage
High-level output current
Low-level output current
Input transition rise or fall rate (slew rate)
4.75 5.25 V
2
V
0.8 V
0 VCC V
0 VCC V
–15 mA
64 mA
10 ns/V
TA
Operating free-air temperature
0
70 °C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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