AMC1200_1108 Datasheet, PDF (2/23 Pages) Texas Instruments – Fully-Differential Isolation Amplifier

AMC1200
SBAS542A – APRIL 2011 – REVISED AUGUST 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over the operating ambient temperature range, unless otherwise noted.
Supply voltage, VDD1 to GND1 or VDD2 to GND2
Analog input voltage at VINP, VINN
Input current to any pin except supply pins
Maximum junction temperature, T_J Max
Electrostatic discharge (ESD) ratings,
all pins
Human body model (HBM)
JEDEC standard 22, test method
A114-C.01
Charged device model (CDM)
JEDEC standard 22, test method
C101
AMC1200
–0.5 to 6
GND1 – 0.5 to VDD1 + 0.5
±10
+150
±2500
±1000
UNIT
V
V
mA
°C
V
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
AMC1200
DUB (SOP)
UNITS
8 PINS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
75.1
61.6
39.8
°C/W
27.2
39.4
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
REGULATORY INFORMATION
VDE/IEC
Certified according to IEC 60747-5-2
File number: 40016131
UL
Recognized under 1577 component recognition program
File number: E181974
2
Copyright © 2011, Texas Instruments Incorporated