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ADS7865 Datasheet, PDF (2/30 Pages) Texas Instruments – Dual, 12-Bit, 3+3 or 2+2 Channel, Simultaneous Sampling Analog-to-Digital Converter
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ADS7865
SBAS441 – OCTOBER 2008.............................................................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
ADS7865I
PACKAGE-LEAD
TQFP-32
PACKAGE
DESIGNATOR
PBS
ORDERING NUMBER
ADS7865IPBS
ADS7865IPBSR
TRANSPORT MEDIA,
QUANTITY
Tray, 250
Tray, 2500
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
Supply voltage, AVDD to AGND
Supply voltage, BVDD to BGND
Supply voltage, BVDD to AVDD
Analog and reference input voltage with respect to AGND
Digital input voltage with respect to BGND
Ground voltage difference |AGND – BGND|
Input current to all pins except power-supply pins
Maximum virtual junction temperature, TJ
ESD ratings
Human body model (HBM),
JEDEC standard 22, test method A114-C.01, all pins
Charged device model (CDM),
JEDEC standard 22, test method C101, all pins
ADS7865
–0.3 to +6
–0.3 to +6
1.5 × AVDD
AGND – 0.3 to AVDD + 0.3
BGND – 0.3 to BVDD + 0.3
0.3
–10 to +10
+150
±4000
±1500
UNIT
V
V
V
V
V
V
mA
°C
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range, unless otherwise noted.
Supply voltage, AVDD to AGND
PARAMETER
Supply voltage, BVDD to BGND
Reference input voltage on REFIN
Analog differential input voltage (CHXX+) – (CHXX–)
Operating ambient temperature range, TA
Low voltage levels
5V logic levels
MIN
2.7
2.7
4.5
0.5
–VREF
–40
ADS7865
NOM
5.0
5.0
2.5
MAX
5.5
3.6
5.5
2.525
+VREF
+125
UNIT
V
V
V
V
V
°C
THERMAL CHARACTERISTICS(1)
Over operating free-air temperature range, unless otherwise noted.
PARAMETER
ADS7865
UNIT
θJA
Junction-to-air thermal resistance
High-K thermal resistance
θJC
Junction-to-case thermal resistance
PD
Device power dissipation at AVDD = 5V and BVDD = 3.3V
56.4
°C/W
20.8
°C/W
44
mW
(1) Tested in accordance with the High-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages with a 3×3 via
array.
2
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