ADS5517 Datasheet, PDF (2/54 Pages) Texas Instruments – 11-BIT, 200 MSPS ADC

ADS5517
SLWS203 – DECEMBER 2007
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
CLKP
CLKM
CLOCKGEN
INP
SHA
INM
11-Bit
ADC
VCM
Reference
Digital
Encoder
and
Serializer
Control
Interface
CLKOUTP
CLKOUTM
LOW_D0_P
LOW_D0_M
D1_D2_P
D1_D2_M
D3_D4_P
D3_D4_M
D5_D6_P
D5_D6_M
D7_D8_P
D7_D8_M
D9_D10_P
D9_D10_M
OVR
LVDS MODE
PACKAGE/ORDERING INFORMATION⁽¹⁾
PRODUCT
PACKAGE-
LEAD
ADS5517
QFN-48 ⁽²⁾
PACKAGE
DESIGNATOR
RGZ
SPECIFIED
TEMPERATURE
RANGE
–40°C to 85°C
PACKAGE
MARKING
AZ5517
ORDERING
NUMBER
ADS5517IRGZT
ADS5517IRGZR
TRANSPORT
MEDIA,
QUANTITY
Tape and Reel,
250
Tape and Reel,
2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θ_JA = 25.41°C/W (0 LFM air flow),
θ_JC = 16.5°C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in x 3 in (7.62 cm x 7.62
cm) PCB.
2
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