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| LP38690_15 Datasheet, PDF (19/31 Pages) Texas Instruments – LP38690, LP38692 1-A Low Dropout CMOS Linear Regulators Stable with Ceramic Output Capacitors | |||
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10.2 Layout Examples
COUT
VOUT
Power Ground
OUT
VIN
IN
CIN
Figure 35. LP38690 TO-252 Package
VIN
CIN
IN 1
Power 2
Ground
N/C 3
Thermal
Pad
6 IN
5 SNS
4 OUT
LP38690, LP38692
SNVS322L â DECEMBER 2004 â REVISED MARCH 2015
COUT
VOUT
VIN
EN
NC
GND
OUT
IN
Power
Ground
CIN
Figure 36. LP38692 SOT-223 Package
CIN
IN 1
Power 2
Ground
EN 3
Thermal
Pad
6 IN
5 SNS
4 OUT
COUT
Figure 37. LP38690 WSON Package
COUT
Figure 38. LP38692 WSON Package
10.3 WSON Mounting
The NGG0006A (No Pullback) 6-Lead WSON package requires specific mounting techniques which are detailed
in the TI Application Report AN-1187 Leadless Leadframe Package (LLP) (SNOA401). Referring to the section
PCB Design Recommendations (Page 5), it should be noted that the pad style which should be used with the
WSON package is the NSMD (non-solder mask defined) type. Additionally, it is recommended the PCB terminal
pads to be 0.2 mm longer than the package pads to create a solder fillet to improve reliability and inspection.
The input current is split between two IN pins, 1 and 6. The two IN pins must be connected together to ensure
that the device can meet all specifications at the rated current.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the DAP.
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive
die attach adhesive. The DAP has no direct electrical (wire) connection to any of the pins. There is a parasitic PN
junction between the die substrate and the device ground. As such, it is strongly recommend that the DAP be
connected directly to the ground at device lead 2 (such as GND). Alternately, but not recommended, the DAP
may be left floating (that is, no electrical connection). The DAP must not be connected to any potential other than
ground.
Copyright © 2004â2015, Texas Instruments Incorporated
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