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TL783_15 Datasheet, PDF (17/27 Pages) Texas Instruments – TL783 High-voltage Adjustable Regulator
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2014
PACKAGING INFORMATION
Orderable Device
TL783CKC
TL783CKCE3
TL783CKCSE3
TL783CKTER
TL783CKTTR
TL783CKTTRG3
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
OBSOLETE TO-220
KC
3
TBD
OBSOLETE TO-220
KC
3
TBD
ACTIVE TO-220
KCS 3
50
Pb-Free
(RoHS)
OBSOLETE PFM
KTE
3
TBD
ACTIVE
DDPAK/
TO-263
KTT
3
500 Green (RoHS
& no Sb/Br)
ACTIVE
DDPAK/
TO-263
KTT
3
500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
Call TI
Call TI
CU SN
Call TI
CU SN
CU SN
MSL Peak Temp
(3)
Call TI
Call TI
N / A for Pkg Type
Op Temp (°C)
0 to 125
0 to 125
0 to 125
Call TI
Level-3-245C-168 HR
0 to 125
0 to 125
Level-3-245C-168 HR 0 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
TL783C
TL783C
TL783C
TL783
TL783C
TL783C
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Samples
Addendum-Page 1