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OPA209_10 Datasheet, PDF (16/25 Pages) Texas Instruments – OPERATIONAL AMPLIFIER
PACKAGE OPTION ADDENDUM
www.ti.com
4-Sep-2010
PACKAGING INFORMATION
Orderable Device
OPA209AID
OPA209AIDBVR
OPA209AIDBVT
OPA209AIDGKR
OPA209AIDGKT
OPA209AIDR
OPA2209AID
OPA2209AIDGKR
OPA2209AIDGKT
OPA2209AIDR
OPA4209AIPW
OPA4209AIPWR
Status (1) Package Type Package
Drawing
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
ACTIVE
SOIC
SOT-23
SOT-23
MSOP
MSOP
SOIC
SOIC
D
DBV
DBV
DGK
DGK
D
D
Pins
8
5
5
8
8
8
8
Package Qty
75
3000
250
2500
250
2500
75
PREVIEW MSOP
DGK
8
PREVIEW MSOP
DGK
8
ACTIVE
SOIC
D
8
2500
250
2500
PREVIEW TSSOP
PW
14
PREVIEW TSSOP
PW
14
90
2000
Eco Plan (2)
TBD
TBD
TBD
TBD
TBD
TBD
Green (RoHS
& no Sb/Br)
TBD
TBD
Green (RoHS
& no Sb/Br)
TBD
TBD
Lead/
Ball Finish
MSL Peak Temp (3)
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(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Purchase Samples
Samples Not Available
Samples Not Available
Request Free Samples
Samples Not Available
Samples Not Available
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1