LP3873_15 Datasheet, PDF (15/24 Pages) Texas Instruments – 3A Fast Ultra Low Dropout Linear Regulators

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LP3873, LP3876
SNVS220E – NOVEMBER 2002 – REVISED APRIL 2013
Figure 25. θ_JA vs Copper (1 Ounce) Area for DDPAK/TO-263 package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The
minimum value for θ_JA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.
Figure 26 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient
temperatures, assuming θ_JA is 35°C/W and the maximum junction temperature is 125°C.
Figure 26. Maximum power dissipation vs ambient temperature for DDPAK/TO-263 package
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