THS9000_15 Datasheet, PDF (13/24 Pages) Texas Instruments – 50 MHz to 750 MHz CASCADEABLE AMPLIFIER

THS9000
www.ti.com
SLOS425E – DECEMBER 2003 – REVISED DECEMBER 2013
Evaluation Module
Table 1 is the bill of materials, and Figure 27 and Figure 28 show the EVM layout.
Bill Of Materials
ITEM
1
2
3
4
5
6
7
8
9
10
11
DESCRIPTION
Cap, 0.1 μF, ceramic, X7R, 50 V
Cap, 1000 pF, ceramic, NPO, 100 V
Inductor, 470 nH, 5%
Resistor, 237 Ω, 1/8 W, 1%
Open
Jack, banana receptance, 0.25" dia.
Connector, edge, SMA PCB jack
Standoff, 4-40 Hex, 0.625" Length
Screw, Phillips, 4-40, .250"
IC, THS9000
Board, printed-circuit
REF DES
C1
C2, C3
L1
R1
TR1
J3, J4
J1, J2
U1
(1) The manufacturer's part numbers are used for test purposes only.
QTY
1
2
1
1
1
2
2
4
4
1
1
PART NUMBER⁽¹⁾
(AVX) 08055C104KAT2A
(AVX) 08051A102JAT2A
(Coilcraft) 0805CS-471XJBC
(Phycomp) 9C08052A2370FKHFT
(SPC) 813
(Johnson) 142-0701-801
(KEYSTONE) 1808
SHR-0440-016-SN
(TI) THS9000DRD
(TI) EDGE # 6453521 Rev.A
Figure 27. EVM Top Layout
Figure 28. EVM Bottom Layout
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