TLC372M Datasheet, PDF (11/20 Pages) Texas Instruments – LIN CMOS DUAL DIFFERENTIAL COMPARATORS

www.ti.com
PACKAGE OPTION ADDENDUM
22-Feb-2005
PACKAGING INFORMATION
Orderable Device
5962-87658012A
5962-8765801PA
5962-9554901NXDR
TLC372CD
TLC372CDR
TLC372CP
TLC372CPSR
TLC372CPW
TLC372CPWLE
TLC372CPWR
TLC372ID
TLC372IDR
TLC372IP
TLC372MD
TLC372MDR
TLC372MFKB
TLC372MJG
TLC372MJGB
TLC372MP
TLC372MUB
TLC372QD
TLC372QDR
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
LCCC
CDIP
SOIC
SOIC
Package
Drawing
FK
JG
D
D
ACTIVE
SOIC
D
ACTIVE
PDIP
P
ACTIVE
SO
PS
ACTIVE TSSOP
PW
OBSOLETE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
P
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
LCCC
FK
ACTIVE
CDIP
JG
ACTIVE
CDIP
JG
ACTIVE
PDIP
P
ACTIVE
CFP
U
ACTIVE
SOIC
D
ACTIVE
SOIC
D
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20
1
None
POST-PLATE Level-NC-NC-NC
8
1
None
A42 SNPB Level-NC-NC-NC
8 2500
None
CU NIPDAU Level-1-220C-UNLIM
8
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
8 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
8
50
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
8 2000
None
CU NIPDAU Level-1-220C-UNLIM
8 150
None
CU NIPDAU Level-1-220C-UNLIM
8
None
Call TI
Call TI
8 2000
None
CU NIPDAU Level-1-220C-UNLIM
8
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
8 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1YEAR/
Level-1-220C-UNLIM
8
50
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
8
75
None
CU NIPDAU Level-1-220C-UNLIM
8 2500
None
CU NIPDAU Level-3-245C-168 HR
20
1
None
POST-PLATE Level-NC-NC-NC
8
1
None
A42 SNPB Level-NC-NC-NC
8
1
None
A42 SNPB Level-NC-NC-NC
8
50
None
Call TI
Level-NC-NC-NC
10
1
None
A42 SNPB Level-NC-NC-NC
8
75
None
CU NIPDAU Level-1-220C-UNLIM
8 2500
None
CU NIPDAU Level-1-220C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Addendum-Page 1