TL3016CDR Datasheet, PDF (10/17 Pages) Texas Instruments – ULTRA-FAST LOW-POWER PRECISION COMPARATORS

PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2010
PACKAGING INFORMATION
Orderable Device
TL3016CD
TL3016CDG4
TL3016CDR
TL3016CDRG4
TL3016CPW
TL3016CPWG4
TL3016CPWLE
TL3016CPWR
TL3016CPWRG4
TL3016ID
TL3016IDG4
TL3016IDR
TL3016IDRG4
TL3016IPW
TL3016IPWG4
TL3016IPWLE
TL3016IPWR
TL3016IPWRG4
Status ⁽¹⁾
ACTIVE
Package
Type
SOIC
Package
Drawing
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
OBSOLETE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
OBSOLETE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
TBD
Call TI
Call TI
8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
TBD
Call TI
Call TI
8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Addendum-Page 1