TS3USB30_08 Datasheet, PDF (1/18 Pages) Texas Instruments – HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

TS3USB30
www.ti.com......................................................................................................................................................... SCDS237D – AUGUST 2007 – REVISED MAY 2008
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
FEATURES
1
• V_CC Operation at 3 V and 4.3 V
• 1.8-V Compatible Control-Pin Inputs
• I_OFF Supports Partial Power-Down-Mode
Operation
• r_on = 10 Ω Max
• Δr_on <0.35 Ω Typ
• C_io(ON) = 7 pF Typ
• Low Power Consumption (1 µA Max)
• ESD Performance Tested Per JESD 22
– 6000-V Human-Body Model (HBM)
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 250-V Machine Model (A115-A)
• –3-dB Bandwidth = 955 MHz Typ
• Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)
APPLICATIONS
• Routes Signals for USB 1.0, 1.1, and 2.0
• Mobile Industry Processor Interface (MIPI)
Signal Routing
RSW PACKAGE
(TOP VIEW)
OE 8
V_CC 9
S 10
76
12
5 D–
4 GND
3 D+
RSW PACKAGE
(BOTTOM VIEW)
S 10
V_CC 9
OE 8
12
76
3 D+
4 GND
5 D–
DESCRIPTION/ORDERING INFORMATION
The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in
handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers
with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge
and phase distortion. The device multiplexes differential outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at
the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0 (480 Mbps).
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER
TQFN – RSW
Tape and reel
TS3USB30RSWR
TOP-SIDE MARKING
L6O
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated