TPIC83000-Q1 Datasheet, PDF (1/44 Pages) Texas Instruments – PRESSURE SENSOR SIGNAL CONDITIONING INTERFACE

TPIC83000-Q1
www.ti.com
SLDS171 – NOVEMBER 2009
PRESSURE SENSOR SIGNAL CONDITIONING INTERFACE
Check for Samples: TPIC83000-Q1
FEATURES
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• Qualified for Automotive Applications
• 10-Bit Pressure and Temperature Output
• On-Board Temperature Sensor
• Programmable Gain / Gain TC1
• Programmable Offset / Offset TC1 / TC2
• On-Board EEPROM for System Calibration
• Operating Temperature Range: –40°C to 85°C
• 16-Pin TSSOP (PW) Package
• UART Interface
APPLICATIONS
• Occupancy Weight Sensing
• Pedal-Pressure Sensing
• General Low-Pressure Sensing
Vcc
VccA
Gnd
REF1
GndA
SIP
Gnd
SIN
PW PACKAGE
(TOP VIEW)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
Vdd
DGnd
DI
DO
TST2
TST1
TST0
ProgV
DESCRIPTION
The TPIC83000 is a single-channel, signal conditioning device for pressure sensors used in low-pressure
sensing applications such as passenger occupancy indication/detection and pedal pressure sensing. The
pressure sensor can be based on either a strain gauge or piezo-resistive elements configured as a full
Wheatstone bridge. This device provides an analog signal conditioning interface between the pressure sensor
and a microcontroller. The analog front end (AFE) inside the device processes the sensed signals from the
pressure sensor by amplifying the signal and cancelling offset. This processed signal is then converted into a
14-bit, digital word using a sigma-delta analog-to-digital converter (ADC). The device also has a built-in 12-bit
ADC that is used to sense ambient temperature to compensate for the temperature coefficient of the sensor and
related processing circuitry. The compensated digital data is transferred to the microprocessor via a built-in
UART interface.
T_A
–40°C to 85°C
TSSOP – PW
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
Reel of 2000
TPIC83000IPWRQ1
TOP-SIDE MARKING
TPIC83000I
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated