TMS320C6727B_07 Datasheet, PDF (1/116 Pages) Texas Instruments – Floating-Point Digital Signal Processors

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TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720
Floating-Point Digital Signal Processors
SPRS370C – SEPTEMBER 2006 – REVISED OCTOBER 2007
1 TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 DSPs
1.1 Features
• C672x: 32-/64-Bit 350-MHz Floating-Point DSPs
• Upgrades to C67x+ CPU From C67x™ DSP
Generation:
– 2X CPU Registers [64 General-Purpose]
– New Audio-Specific Instructions
– Compatible With the C67x CPU
• Enhanced Memory System
– 256K-Byte Unified Program/Data RAM
– 384K-Byte Unified Program/Data ROM
– Single-Cycle Data Access From CPU
– Large Program Cache (32K Byte) Supports
RAM, ROM, and External Memory
• External Memory Interface (EMIF) Supports
– 133-MHz SDRAM (16- or 32-Bit)
– Asynchronous NOR Flash, SRAM (8-,16-, or
32-Bit)
– NAND Flash (8- or 16-Bit)
• Enhanced I/O System
– High-Performance Crossbar Switch
– Dedicated McASP DMA Bus
– Deterministic I/O Performance
• dMAX (Dual Data Movement Accelerator)
Supports:
– 16 Independent Channels
– Concurrent Processing of Two Transfer
Requests
– 1-, 2-, and 3-Dimensional
Memory-to-Memory and
Memory-to-Peripheral Data Transfers
– Circular Addressing Where the Size of a
Circular Buffer (FIFO) is not Limited to 2ⁿ
– Table-Based Multi-Tap Delay Read and
Write Transfers From/To a Circular Buffer
• Three Multichannel Audio Serial Ports
– Transmit/Receive Clocks up to 50 MHz
– Six Clock Zones and 16 Serial Data Pins
– Supports TDM, I2S, and Similar Formats
– DIT-Capable (McASP2)
• Universal Host-Port Interface (UHPI)
– 32-Bit-Wide Data Bus for High Bandwidth
– Muxed and Non-Muxed Address and Data
• Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin
Options
• Two Inter-Integrated Circuit (I2C) Ports
• Real-Time Interrupt Counter/Watchdog
• Oscillator- and Software-Controlled PLL
• Applications:
– Professional Audio
• Mixers
• Effects Boxes
• Audio Synthesis
• Instrument/Amp Modeling
• Audio Conferencing
• Audio Broadcast
• Audio Encoder
– Emerging Audio Applications
– Biometrics
– Medical
– Industrial
• Commercial or Extended Temperature
• 144-Pin, 0.5-mm, PowerPAD™ Thin Quad
Flatpack (TQFP) [RFP Suffix]
• 256-Terminal, 1.0-mm, 16x16 Array Plastic Ball
Grid Array (PBGA) [GDH and ZDH Suffixes]
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
C67x, PowerPAD, TMS320C6000, C6000, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments.
Philips is a registered trademark of Koninklijki Philips Electronics N.V.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated