TMS320C6474FGUN Datasheet, PDF (1/214 Pages) Texas Instruments – TMS320C6474 Multicore Digital Signal Processor

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TMS320C6474
SPRS552H – OCTOBER 2008 – REVISED APRIL 2011
TMS320C6474 Multicore Digital Signal Processor
1 Features
12
• Key Features
– High-Performance Multicore DSP (C6474)
– Instruction Cycle Time: 0.83 ns (1.2-GHz
Device); 1 ns (1-GHz Device); 1.18 ns
(850-MHz Device)
– Clock Rate: 1 GHz to 1.2 GHz (1.2-GHz
Device); 1 GHz (1-GHz Device); 850 MHz
(850-MHz Device)
– Commercial Temperature and Extended
Temperature
– 3 TMS320C64x+™ DSP Cores; Six RSAs for
CDMA Processing (2 per core)
– Enhanced VCP2/TCP2
– Frame Synchronization Interface
– 16-/32-Bit DDR2-667 Memory Controller
– EDMA3 Controller
– Antenna Interface
– Two 1x Serial RapidIO^® Links, v1.2
Compliant
– One 1.8-V Inter-Integrated Circuit (I2C) Bus
– Two 1.8-V McBSPs
– 1000 Mbps Ethernet MAC (EMAC)
– Six 64-Bit General-Purpose Timers
– 16 General-Purpose I/O (GPIO) Pins
– Internal Semaphore Module
– System PLL and PLL Controller/DDR PLL
and PLL Controller, Dedicated to DDR2
Memory Controller
• High-Performance Multicore DSP (C6474)
– Instruction Cycle Time:
• 1.2-GHz Device: 0.83-ns
• 1-GHz Device: 1-ns
• 850-MHz Device: 1.18 ns
– Clock Rate:
• 1.2-GHz Device: 1 GHz to 1.2 GHz
• 1-GHz Device: 1 GHz
• 850-MHz Device: 850 MHz
– Eight 32-Bit Instructions/Cycle
– Commercial Temperature:
• 1.2-GHz Device: 0°C to 95°C
• 850-MHZ and 1-GHz Device: 0°C to 100°C
– Extended Temperature:
• 1.2-GHz Device: -40°C to 95°C⁽¹⁾
• 1-GHz Device: -40°C to 100°C
• 3 TMS320C64x+™ DSP Cores
– Dedicated SPLOOP Instructions
– Compact Instructions (16-Bit)
– Exception Handling
• TMS320C64x+ Megamodule L1 Memory
Architecture
– 256 K-Bit (32 K-Byte) L1P Program Cache
[Direct Mapped]
– 256 K-Bit (32 K-Byte) L1D Data Cache
[2-Way Set-Associative]
– 512 K-Bit (64 K-Byte) L3 ROM
• Enhanced VCP2
– Supports Over 694 7.95-Kbps AMR
• Enhanced Turbo Decoder Coprocessor (TCP2)
– Supports up to Eight 2-Mbps 3 GPP
(6 Iterations)
• Endianness: Little Endian, Big Endian
• Frame Synchronization Interface
– Time Alignment Between Internal
Subsystems, External Devices/System
– OBSAI RP1 Compliant for Frame Burst Data
– Alternate Interfaces for non-RP1 and
non-UMTS Systems
• 16-/32-Bit DDR2-667 Memory Controller
• EDMA3 Controller (64 Independent Channels)
• Antenna Interface
– 6 Configurable Links (Full Duplex)
– Supports OBSAI RP3 Protocol, v1.0:
768-Mbps, 1.536-, 3.072-Gbps Link Rates
– Supports CPRI Protocol V2.0: 614.4-Mbps,
1.2288-, 2.4576-Gbps Link Rates
– Clock Input Independent or Shared with CPU
(Selectable at Boot-Time)
• Two 1x Serial RapidIO^® Links, v1.2 Compliant
– 1.25-, 2.5-, 3.125-Gbps Link Rates
– Message Passing and DirectIO Support
– Error Management Extensions and
Congestion Control
• One 1.8-V Inter-Integrated Circuit (I2C) Bus
• Two 1.8-V McBSPs
(1)
Note: Advance Information is presented in this document for
the C6474 1.2-GHz extended temperature device.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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