SN74LVC2G79 Datasheet, PDF (1/13 Pages) Texas Instruments – DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

SN74LVC2G79
DUAL POSITIVEĆEDGEĆTRIGGERED DĆTYPE FLIPĆFLOP
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 4.2 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
D I_off Feature Supports Partial-Power-Down
Mode Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SCES498B − OCTOBER 2003 − REVISED DECEMBER 2003
DCT OR DCU PACKAGE
(TOP VIEW)
1CLK 1
1D 2
2Q 3
GND 4
8 V_CC
7 1Q
6 2D
5 2CLK
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2CLK
2Q 3 6 2D
1D 2 7 1Q
1CLK 1 8 V_CC
description/ordering information
This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V_CC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on
the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related
to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the levels at the outputs.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
−40°C to 85°C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Tape and reel
SN74LVC2G79YEPR
SN74LVC2G79YZPR
_ _ _CR_
SSOP − DCT
Tape and reel SN74LVC2G79DCTR C79_ _ _
VSSOP − DCU
Tape and reel SN74LVC2G79DCUR C79_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.}
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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