SN74LVC1G98 Datasheet, PDF (1/16 Pages) Texas Instruments – CONFIGURABLE MULTIPLE-FUNCTION GATE

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SN74LVC1G98
CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES417H – DECEMBER 2002 – REVISED JUNE 2005
FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 6.3 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
In1
1
GND
2
In1
1
6 In2
In1 1
6 In2
In0 ^{3 4} Y
6
5
In2
GND
V_CC
In0
2
3
5
V_CC
GND 2
In0 3
5 V_CC
4Y
GND ^{2 5}
In1 ^{1 6}
V_CC
In2
4Y
In0
3
4
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G98 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All
inputs can be connected to V_CC or GND.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
ORDERABLE PART NUMBER
SN74LVC1G98YEAR
TOP-SIDE MARKING⁽²⁾
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC1G98YZAR
Reel of 3000
SN74LVC1G98YEPR
_ _ _CW_
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G98YZPR
SOT (SOT-23) – DBV
Reel of 3000 SN74LVC1G98DBVR
Reel of 250 SN74LVC1G98DBVT
C98_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G98DCKR
Reel of 250 SN74LVC1G98DCKT
CW_
SOT (SOT-553) – DRL
Reel of 4000 SN74LVC1G98DRLR
CW_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2005, Texas Instruments Incorporated