SN74CB3T3383 Datasheet, PDF (1/19 Pages) Texas Instruments – 10-BIT FET BUS-EXCHANGE SWITCH 2.5V/3.3-V LOW-VOLTAGE BUSSWITCH WITH 5-V-TOLERANT LEVEL SHIFTER

SN74CB3T3383
10ĆBIT FET BUSĆEXCHANGE SWITCH
2.5ĆV/3.3ĆV LOWĆVOLTAGE BUS SWITCH WITH 5ĆVĆTOLERANT LEVEL SHIFTER
SCDS158A − OCTOBER 2003 − REVISED DECEMBER 2004
D Output Voltage Translation Tracks V_CC
D Supports Mixed-Mode Signal Operation On
All Data I/O Ports
− 5-V Input Down To 3.3-V Output Level
Shift With 3.3-V V_CC
− 5-V/3.3-V Input Down To 2.5-V Output
Level Shift With 2.5-V V_CC
D 5-V-Tolerant I/Os With Device Powered Up
or Powered Down
D Bidirectional Data Flow, With Near-Zero
Propagation Delay
D Low ON-State Resistance (r_on)
Characteristics (r_on = 5 Ω Typical)
D Low Input/Output Capacitance Minimizes
Loading (C_io(OFF) = 8 pF Typical)
D Data and Control Inputs Provide
Undershoot Clamp Diodes
D V_CC Operating Range From 2.3 V to 3.6 V
D Data I/Os Support 0- to 5-V Signaling
Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V,
5 V)
D Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 250 mA Per
JESD 17
D ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
D Supports Digital Applications: Level
Translation, Memory Interleaving, Bus
Isolation
D Low Power Consumption
(I_CC = 20 µA Max)
D Ideal for Low-Power Portable Equipment
DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
BE ¹
1B1 ²
1A1 ³
1A2 ⁴
1B2 ⁵
2B1 ⁶
2A1 ⁷
2A2 ⁸
2B2 ⁹
3B1 ¹⁰
3A1 ¹¹
GND ¹²
24 _VCC
23 _5B2
22 _5A2
21 _5A1
20 _5B1
19 _4B2
18 _4A2
17 _4A1
16 _4B1
15 _3B2
14 _3A2
13 _BX
description/ordering information
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC − DW
Tube
Tape and reel
SN74CB3T3383DW
SN74CB3T3383DWR
CB3T3383
−40°C to 85°C
SSOP (QSOP) − DBQ
TSSOP − PW
Tape and reel
Tube
Tape and reel
SN74CB3T3383DBQR
SN74CB3T3383PW
SN74CB3T3383PWR
CB3T3383
KS383
TVSOP − DGV
Tape and reel SN74CB3T3383DGVR KS383
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are}
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2004, Texas Instruments Incorporated
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