SN74CB3Q3306ADCUR Datasheet, PDF (1/15 Pages) Texas Instruments – Dual FET Bus Switch 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch

SN74CB3Q3306A
www.ti.com
SCDS113E – DECEMBER 2002 – REVISED JANUARY 2011
Dual FET Bus Switch 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch
Check for Samples: SN74CB3Q3306A
FEATURES
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• High-Bandwidth Data Path (up to 500 MHz⁽¹⁾)
• 5-V-Tolerant I/Os With Device Powered Up or
Powered Down
• Low and Flat ON-State Resistance (r_on)
Characteristics Over Operating Range
(r_on = 4 Ω Typ)
• Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V V_CC
– 0- to 3.3-V Switching With 2.5-V V_CC
• Bidirectional Data Flow With Near-Zero
Propagation Delay
• Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(C_io(OFF) = 3.5 pF Typ)
• Fast Switching Frequency (f _OE = 20 MHz Max)
(1) _{For additional information regarding the performance}
characteristics of the CB3Q family, refer to the TI application
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,
literature number SCDA008.
DCU PACKAGE
(TOP VIEW)
1OE 1
1A 2
1B 3
GND 4
8
V_CC
7 2OE
6 2B
5 2A
• Data and Control Inputs Provide Undershoot
Clamp Diodes
• Low Power Consumption (I_CC = 0.25 mA Typ)
• V_CC Operating Range From 2.3 V to 3.6 V
• Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
• Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• Supports Both Digital and Analog
Applications: USB Interface, Differential Signal
Interface, Bus Isolation, Low-Distortion Signal
Gating
PW PACKAGE
(TOP VIEW)
1OE 1
1A 2
1B 3
GND 4
8 V_CC
7 2OE
6 2B
5 2A
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
TSSOP – PW
Tube
Tape and reel
SN74CB3Q3306APW
SN74CB3Q3306APWR
US8-DCU
Tape and reel
SN74CB3Q3306ADCUR
74CB3Q3306ADCURE4
TOP-SIDE MARKING
BU306A
GA6R ⁽²⁾
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) The last character designates assembly/test site.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2011, Texas Instruments Incorporated