SN74AUC1G06 Datasheet, PDF (1/13 Pages) Texas Instruments – SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

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FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
• I_off Supports Partial-Power-Down Mode
Operation
• Sub-1-V Operable
• Max t_pd of 2.5 ns at 1.8 V
• Low Power Consumption, 10-µA Max I_CC
• ±8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74AUC1G06
SINGLE INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES372J – SEPTEMBER 2001 – REVISED JUNE 2005
DBV OR DCK PACKAGE
(TOP VIEW)
NC ¹
A²
GND ³
5 V_CC
4Y
NC - No internal connection
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 3 4 Y
A2
DNU 1 5 V_CC
DNU - Do not use
DESCRIPTION/ORDERING INFORMATION
This single inverter buffer/driver is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.65-V to
1.95-V V_CC operation.
The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
T_A
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
ORDERABLE PART NUMBER
SN74AUC1G06YEAR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA
(Pb-free)
NanoStar™ – WCSP (DSBGA)
–40°C to 85°C _{0.23-mm Large Bump – YEP}
SN74AUC1G06YZAR
Tape and reel
SN74AUC1G06YEPR
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SN74AUC1G06YZPR
SOT (SOT-23) – DBV
Tape and reel SN74AUC1G06DBVR
SOT (SC-70) – DCK
Tape and reel SN74AUC1G06DCKR
TOP-SIDE MARKING⁽²⁾
_ _ _UT_
U06_
UT_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2005, Texas Instruments Incorporated