DRV8835_15 Datasheet, PDF (1/19 Pages) Texas Instruments – DUAL LOW VOLTAGE H-BRIDGE IC

DRV8835
www.ti.com
SLVSB18D – MARCH 2012 – REVISED JANUARY 2014
DUAL LOW VOLTAGE H-BRIDGE IC
Check for Samples: DRV8835
FEATURES
1
•2 Dual-H-Bridge Motor Driver
– Capable of Driving Two DC Motors or One
Stepper Motor
– Low MOSFET On-Resistance:
HS + LS 305 mΩ
• 1.5-A Maximum Drive Current Per H-Bridge
• Bridges May Be Paralleled for 3-A Drive
Current
• Separate Motor and Logic Supply Pins:
– 0-V to 11-V Motor-Operating Supply-Voltage
Range
– 2-V to 7-V Logic Supply-Voltage Range
• Separate Logic and Motor Power Supply Pins
• Flexible PWM or PHASE/ENABLE Interface
• Low-Power Sleep Mode With 95-nA Maximum
Supply Current
• Tiny 2-mm x 3-mm WSON Package
APPLICATIONS
• Battery-Powered:
– Cameras
– DSLR Lenses
– Consumer Products
– Toys
– Robotics
– Medical Devices
DESCRIPTION
The DRV8835 provides an integrated motor driver solution for cameras, consumer products, toys, and other low-
voltage or battery-powered motion control applications. The device has two H-bridge drivers, and can drive two
DC motors or one stepper motor, as well as other devices like solenoids. The output driver block for each
consists of N-channel power MOSFET’s configured as an H-bridge to drive the motor winding. An internal charge
pump generates needed gate drive voltages.
The DRV8835 can supply up to 1.5-A of output current per H-bridge. It operates on a motor power supply voltage
from 0 V to 11 V, and a device power supply voltage of 2 V to 7 V.
PHASE/ENABLE and IN/IN interfaces can be selected which are compatible with industry-standard devices.
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage
lockout and overtemperature.
The DRV8835 is packaged in a tiny 12-pin WSON package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).
PACKAGE ⁽²⁾
PowerPAD™ (WSON) - DSS
ORDERING INFORMATION⁽¹⁾
ORDERABLE PART
NUMBER
Reel of 3000
DRV8835DSSR
TOP-SIDE
MARKING
835
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2014, Texas Instruments Incorporated