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DRV8803_15 Datasheet, PDF (1/20 Pages) Texas Instruments – QUAD LOW-SIDE DRIVER IC
DRV8803
www.ti.com
SLVSAW5B – JULY 2011 – REVISED FEBRUARY 2012
QUAD LOW-SIDE DRIVER IC
Check for Samples: DRV8803
FEATURES
1
•2 4-Channel Protected Low-Side Driver
– Four NMOS FETs With Overcurrent
Protection
– Integrated Inductive Catch Diodes
– Parallel Interface
• DW Package: 1.5-A (Single Channel On) /
800-mA (Four Channels On) Maximum Drive
Current per Channel (at 25°C)
• PWP Package: 2-A (Single Channel On) /
1-A (Four Channels On) Maximum Drive
Current per Channel (at 25°C, With Proper PCB
Heatsinking)
• 8.2-V to 60-V Operating Supply Voltage Range
• Thermally Enhanced Surface Mount Package
APPLICATIONS
• Relay Drivers
• Unipolar Stepper Motor Drivers
• Solenoid Drivers
• General Low-Side Switch Applications
DESCRIPTION
The DRV8803 provides a 4-channel low side driver with overcurrent protection. It has built-in diodes to clamp
turn-off transients generated by inductive loads and can be used to drive unipolar stepper motors, DC motors,
relays, solenoids, or other loads.
In the SOIC (DW) package, the DRV8803 can supply up to 1.5-A (one channel on) or 800-mA (all channels on)
continuous output current per channel, at 25°C. In the HTSSOP (PWP) package, it can supply up to 2-A (one
channel on) or 1-A (four channels on) continuous output current per channel, at 25°C with proper PCB
heatsinking.
The device is controlled via a simple parallel interface.
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage
lockout and overtemperature and faults are indicated by a fault output pin.
The DRV8803 is available in a 20-pin thermally-enhanced SOIC package and a 16-pin HTSSOP package (Eco-
friendly: RoHS & no Sb/Br).
PACKAGE (2)
(SOIC) - DW
(HTSSOP) - PWP
ORDERING INFORMATION(1)
ORDERABLE PART
NUMBER
Reel of 2000
DRV8803DWR
Tube of 25
DRV8803DW
Reel of 2000
DRV8803PWPR
Tube of 90
DRV8803PWP
TOP-SIDE
MARKING
DRV8803
DRV8803
DRV8803
DRV8803
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2012, Texas Instruments Incorporated