DAC5681Z_15 Datasheet, PDF (1/58 Pages) Texas Instruments – 16-BIT, 1.0 GSPS 2x-4x INTERPOLATING DIGITAL-TO-ANALOG CONVERTER (DAC)

DAC5681Z
www.ti.com
SLLS865F – AUGUST 2007 – REVISED AUGUST 2012
16-BIT, 1.0 GSPS 2x-4x INTERPOLATING
DIGITAL-TO-ANALOG CONVERTER (DAC)
Check for Samples: DAC5681Z
FEATURES
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• 16-Bit Digital-to-Analog Converter (DAC)
• 1.0 GSPS Update Rate
• 16-Bit Wideband Input LVDS Data Bus
– 8 Sample Input FIFO
• High Performance
– 73 dBc ACLR WCDMA TM1 at 180 MHz
• 2x-32x Clock Multiplying PLL/VCO
• 2x or 4x Interpolation Filters
– Stopband Transition 0.4–0.6 Fdata
– Filters Configurable in Either Low-Pass or
High-Pass Mode
– Allows Selection of Higher Order Image
• On Chip 1.2 V Reference
• Differential Scalable Output: 2 to 20 mA
• Package: 64-Pin 9 × 9 mm QFN
APPLICATIONS
• Cellular Base Stations
• Broadband Wireless Access (BWA)
• WiMAX 802.16
• Fixed Wireless Backhaul
• Cable Modem Termination System (CMTS)
DESCRIPTION
The DAC5681Z is a 16-bit 1.0 GSPS digital-to-analog
converter (DAC) with wideband LVDS data input,
integrated 2x/4x interpolation filters, on-board clock
multiplier and internal voltage reference. The
DAC5681Z offers superior linearity, noise, crosstalk
and PLL phase noise performance.
The DAC5681Z integrates a wideband LVDS port
with on-chip termination. Full-rate input data can be
transferred to a single DAC channel, or half-rate and
1/4-rate input data can be interpolated by on-board
2x or 4x FIR filters. Each interpolation FIR is
configurable in either Low-Pass or High-Pass mode,
allowing selection of a higher order output spectral
image. An on-chip delay lock loop (DLL) simplifies
LVDS interfacing by providing skew control for the
LVDS input data clock.
The DAC5681Z is characterized for operation over
the industrial temperature range of –40°C to 85°C
and is available in a 64-pin QFN package. Other
members of the family include the dual-channel,
interpolating DAC5682Z and the single-channel, non-
interpolating DAC5681.
T_A
–40°C to 85°C
ORDER CODE
DAC5681ZIRGCT
DAC5681ZIRGCR
ORDERING INFORMATION
PACKAGE DRAWING/TYPE^{(1) (2) (3)}
RGC / 64QFN Quad Flatpack No-Lead
TRANSPORT MEDIA
Tape and Reel
Tape and Reel
QUANTITY
250
2000
(1) Thermal Pad Size: 7,4 mm × 7,4 mm
(2) MSL Peak Temperature: Level-3-260C-168 HR
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2012, Texas Instruments Incorporated