TCMT4100 Datasheet, PDF (8/9 Pages) Vishay Siliconix – Half Pitch Mini-Flat Package

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TCMT4100, TCMT4106
Vishay Semiconductors
TAPE AND REEL PACKAGING FOR TCMT410X SERIES (in millimeters)
technical drawings
according to DIN
specification
2
4
2.6
0.3
7.4
12
2.2
Direction of pulling out
Fig. 19 - 2000 pcs/reel
TAPE AND REEL PACKAGING FOR TCMT410XT0 SERIES (in millimeters)
2.6
2
4
technical drawings
according to DIN
specification
18427
0.3
7.4
12
Direction of pulling out
Fig. 20 - 2000 pcs/reel
2.2
18427_1
SOLDER PROFILE
300
250 ^{255 °C}
240 °C
217 °C
200
max. 260 °C
245 °C
max. 30 s
150
max. 120 s
max. 100 s
100
max. ramp down 6 °C/s
50 _{max. ramp up 3 °C/s}
0
0
19841
50 100 150 200 250 300
Time (s)
Fig. 21 - Lead (Pb)-free Reflow Solder Profile
according to J-STD-020
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: T_amb < 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
Rev. 1.1, 19-Jan-16
8
Document Number: 84181
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000