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SUD50N04 Datasheet, PDF (2/9 Pages) Vishay Telefunken – N-Channel 40-V (D-S) MOSFET
SUD50N04-8m8P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Dynamicb
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V, ID = 250 µA
ID = 1.0 mA
VDS = VGS, ID = 250 µA
VDS = 0 V, VGS = ± 20 V
VDS = 40 V, VGS = 0 V
VDS = 40 V, VGS = 0 V, TJ = 70 °C
VDS ≥ 5 V, VGS = 10 V
VGS = 10 V, ID = 20 A
VGS = 4.5 V, ID = 15 A
VDS = 15 V, ID = 15 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Ciss
Coss
Crss
Qg
VDS = 20 V, VGS = 0 V, f = 1 MHz
VDS = 20 V, VGS = 10 V, ID = 20 A
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Drain-Source Body Diode Characteristics
VDS = 20 V, VGS = 4.5 V, ID = 20 A
f = 1 MHz
VDD = 20 V, RL = 1 Ω
ID ≅ 20 A, VGEN = 4.5 V, Rg = 1 Ω
VDD = 20 V, RL = 1 Ω
ID ≅ 20 A, VGEN = 10 V, Rg = 1 Ω
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Currenta
ISM
TC = 25 °C
Body Diode Voltage
VSD
IS = 10 A
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Qrr
ta
IF = 20 A, dI/dt = 100 A/µs, TJ = 25 °C
Reverse Recovery Rise Time
tb
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Min.
40
1.5
50
2.5
Typ.
Max.
Unit
44
- 5.9
0.0069
0.0084
75
3.0
± 100
1
20
0.0088
0.0105
V
mV/°C
V
nA
µA
A
Ω
S
2400
260
pF
100
37
56
16
24
nC
6.5
4.5
5.5
8.5
Ω
30
45
15
25
45
70
15
25
ns
9
15
5
10
40
60
5
10
40
A
100
0.81
1.2
V
22
35
ns
14
25
nC
11
ns
11
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 68647
S10-0109-Rev. B, 18-Jan-10