SIA444DJT Datasheet, PDF (1/8 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET

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SiA444DJT
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) (Ω)
0.017 at V_GS = 10 V
0.022 at V_GS = 4.5 V
I_D (A) ^a
12
12
Thin PowerPAK^® SC-70-6L Single
D
D6
S5
4
Q_g (TYP.)
5 nC
0.6 mm
1 _2.05 ^mm
Top View
S
1
7
2D
3D
G
Bottom View
Marking Code: AM
Ordering Information:
SiA444DJT-T1-GE3 (lead (Pb)-free and halogen-free)
SiA444DJT-T4-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• TrenchFET^® power MOSFET
• New thermally enhanced PowerPAK^® SC-70
package
- Small footprint area
- Ultra-thin 0.6 mm height
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• DC/DC converter
• High frequency switching
G
N-Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 300 μs)
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
P_D
T_J, T_stg
LIMIT
30
± 20
12 ^a
12 ^a
11 ^{a, b, c}
8.8 ^{b, c}
40
12 ^a
2.9 ^{b, c}
19
12
3.5 ^{b, c}
2.2 ^{b, c}
-55 to +150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
SYMBOL
R_thJA
R_thJC
TYPICAL
28
5.3
MAXIMUM
36
6.5
UNIT
°C/W
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The Thin PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S15-0071-Rev. D, 19-Jan-15
1
Document Number: 67056
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000